Nano Dimension interview airs on Bloomberg US


CEO discusses the company’s latest product developments and M&A

Sunrise, Florida, June 25, 2021 (GLOBE NEWSWIRE) – NanoDimension Ltd. (NASDAQ: NNDM), an industry leading provider of Adiditive M.produced E.Electronics (A me) /SPORTS (3D printed electronics) systems, today announced an interview with Yoav Stern, Chief Executive Officer of Nano Dimension The RedChip Money Report® on the Bloomberg An estimated 73 million homes will be available in the US next Saturday, June 26 at 7:00 p.m. local time.

In an exclusive interview, Mr. Stern speaks about the company’s 3D printing technology for rapid prototyping, investments in product development and research and development as well as the establishment of new sales channels worldwide and the implementation of a robust M&A strategy.

To view the interview segment, please visit:

The RedChip Money Report® provides insightful commentary on small-cap investing, interviews with Wall Street analysts, financial book reviews, and interviews with executives of publicly traded companies.

About nano dimension
Nano Dimension (Nasdaq: NNDM) is a provider of intelligent machines for manufacturing additively manufactured electronics (AME). Active electronic and electromechanical high-fidelity sub-assemblies are integral prerequisites for autonomous intelligent drones, cars, satellites, smartphones and medical in vivo devices. They require iterative development, IP security, fast time to market, and device performance upgrades, which require AME for in-house rapid prototyping and production. The DragonFly LDM® System is used in a wide variety of industries including academic and research institutions, defense, aerospace, autonomous automotive, robotics, and biotechnology. Its ability to prototype on-site in hours instead of weeks; Create better performing products; reduce the size and weight of electronic parts and devices; Enable innovations; and critical to protecting IP, is a paradigm shift in the way industry and research institutes research, develop, and manufacture high-performance electronic devices (Hi-PEDs®) simultaneously while concurrently using in-situ capacitors, antennas, Coils, transformers and electromechanical components are integrated to function with unprecedented performance. Nano Dimension bridges the gap between PCB and integrated semiconductor circuits. A revolution at the push of a button: From CAD to functional high-performance AME device in hours, at the expense of consumables alone. For more information, please visit


Yael Sandler, Chief Financial Officer | [email protected]

US investor relations:
Dave Gentry
RedChip Companies Inc.
[email protected]
407-491-4498 or 1-800-RED-CHIP (733-2447)

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